SMILENEWS365

USI to Launch Next-Generation 1.6T Optical Module Targeting AI and High-Performance Data Center Applications
- 2025-07-25 07:00
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DIGITIMES ASIA: Meta-backed OCP pushes open alternative to closed AI hardware ecosystem
- 2025-07-24 11:40
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KLEVV LAUNCHES ENHANCED SSD LINEUP: CRAS C925G, CRAS C910G NVME SSDS, AND NEO N410+ SATA SSD
- 2025-07-24 10:00
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SK hynix Announces 2Q25 Financial Results
- 2025-07-24 06:47
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SEMI Reports Global Total Semiconductor Equipment Sales Forecast to Reach $125.5 Billion in 2025
- 2025-07-22 22:00
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Baya Systems Receives Frost & Sullivan's 2025 Global Semiconductor IP Interconnect Solutions Technology Innovation Leadership Recognition for Advancing Flexible, Scalable High-Performance Architectures
- 2025-07-22 21:00
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SEMI Foundation Launches NSF-Powered National Call for Applicants of Regional Nodes to Meet Industry Needs for the U.S. Microelectronics Workforce
- 2025-07-21 22:00
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DIVIDEND ALERT: US$0.836 CASH DIVIDEND TO BE DISTRIBUTED ON JULY 25 TO ChipMOS ADS HOLDERS PRE-WITHHOLDING TAX AND FEES
- 2025-07-21 18:00
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UNISOC Launches Flagship 4G SoC T7300, Delivering Comprehensive Upgrades in Entertainment and Gaming
- 2025-07-21 17:04
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DA NANG GLOBAL BUSINESS SUMMIT 2025: DA NANG NEW AREA: TECHNOLOGY-DRIVEN GROWTH ACROSS INDUSTRIES
- 2025-07-21 15:08
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SEMIFIVE Files for Pre-IPO Review on KRX
- 2025-07-18 11:52
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Synopsys Completes Acquisition of Ansys
- 2025-07-17 21:01
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Mouser Brings Innovation and Insights to EMAX Asia 2025
- 2025-07-17 10:52
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ZEISS Group Appoints Martin Fischer as President and CEO of ZEISS Greater China
- 2025-07-17 10:00
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InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration
- 2025-07-15 22:54
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ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
- 2025-07-15 22:00
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FIC Global Leads the Switch from Electrons to Photons for AI Factories
- 2025-07-15 20:09
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NX Group Receives Intel's 2025 EPIC Supplier Award
- 2025-07-15 15:00
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SK keyfoundry, in Collaboration with LB Semicon, Co-Develops Direct RDL to Advance Semiconductor Packaging and Strengthen Competitiveness in Automotive High-Performance Semiconductors
- 2025-07-15 08:00
- 문용민 기자
SolidVue and Lumotive Collaborate to Advance Next-Generation LiDAR Systems
- 2025-07-14 22:00
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JNTC Unveils Next-Generation Glass Substrate for Semiconductors
- 2025-07-14 20:00
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SurplusGLOBAL Receives Minister of Trade Award at '2025 Trade Security Day'
- 2025-07-11 20:00
- 문용민 기자
Mouser Electronics New Product Insider: Over 15,000 New Parts Added in Second Quarter of 2025
- 2025-07-11 18:41
- 문용민 기자
SurplusGLOBAL Receives Minister of Trade Award at '2025 Trade Security Day'
- 2025-07-11 09:00
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